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DE300DL Magnetron Sputtering System
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DE300DL Magnetron Sputtering System

LOAD LOCK pre-vacuum sample chamber, front-opening sputtering chamber, condensate pump and dry pump, 3 magnetron sputtering sources, DC, RF or pulsed power supply, up or down sputtering maximum 6” substrate rotation Substrate bias voltage (optional) Substrate heating 1000 degrees (optional) Up to four process gas PID sputtering pressure control system manual or automatic control Good film uniformity and repeatability Can deposit metal, semiconductor and insulating materials Deposition of multilayer films and alloy films>

LOAD LOCK pre-vacuum sample chamber, front-opening sputtering chamber, condensate pump and dry pump, 3 magnetron sputtering sources, DC, RF or pulsed power supply, up or down sputtering maximum 6” substrate rotation Substrate bias voltage (optional) Substrate heating 1000 degrees (optional) Up to four process gas PID sputtering pressure control system manual or automatic control Good film uniformity and repeatability Can deposit metal, semiconductor and insulating materials Deposition of multilayer films and alloy films>

 

Features

D-type sputtering coating chamber, with front door open for easy internal operation

PID downstream and upstream pressure control

Good film uniformity and repeatability

Safety interlock protection of key components

 

Main configuration

Sputtering chamber

Magnetron sputtering vacuum chamber The cavity is 304 stainless steel and has an observation window
Vacuum pump Molecular pump (or condensate pump) and dry pump
Vacuum valve Electric control high vacuum flapper valve
Cavity inflation valve, rough pumping and front stage angle valve, gas stop valve
Vacuum measurement Wide range vacuum gauge for measuring vacuum and Pirani roughing gauge
Sputtering source Up to 3 4-inch circular magnetron sputtering sources can be equipped with DC, pulsed DC or RF power
Sample table Rotary heating or water cooling of sample stage
Pressure control Multi-channel gas flow meter
A pressure gauge for PID control of sputtering pressure
Cold water safety interlock Sputtering source cooling water distribution water flow sensor interlocking protection for sputtering source safety

 

Main Specifications

Ultimate vacuum of sputtering chamber Better than 5E-8 Torr
Loading capacity Flat substrate up to 6 inches
Maximum temperature of sample heater 600 degrees (optional 1000 degrees)
Film thickness uniformity (2000 angstrom aluminum film) The film thickness uniformity is better than +/-5% on a rotating 6-inch silicon substrate
Universal sputtering pressure 1-50 mtorr
Product description
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