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DE500 magnetron sputtering thin film deposition system
DE500磁控溅射薄膜沉积系统001
DE500磁控溅射薄膜沉积系统003
DE500磁控溅射薄膜沉积系统002
DE500磁控溅射薄膜沉积系统001
DE500磁控溅射薄膜沉积系统003
DE500磁控溅射薄膜沉积系统002

DE500 magnetron sputtering thin film deposition system

Stainless steel cavity, door opening before seal with rubber ring, equipped with molecular pump or condensate pump and dry pump and corresponding valves, full range vacuum gauge, multi-target position, multi-channel gas, PLC and industrial computer control

Configuration and overview:
Stainless steel cavity, door opening before seal with rubber ring, equipped with molecular pump or condensate pump and dry pump and corresponding valves, full range vacuum gauge, multi-target position, multi-channel gas, PLC and industrial computer control

Options:
       2 inch to 8 inch sputtering cathode
       DC or RF power supply
       The substrate can be up to 8 inches
       The substrate can be heated to 950 degrees
       The substrate can be cooled and temperature controlled by liquid nitrogen
       The substrate can be rotated
       Substrate plus magnetic field
      Thickness meter
       Ion source cleaning or auxiliary deposition
       RHEED
       The substrate oxidation process
       Substrate pre-cleaning
       LOAD LOCK
       Glove box
       Vacuum interconnection or vacuum robot substrate transfer

Features:
      It is convenient for operation and maintenance inside the cavity
      High vacuum or ultra-high vacuum
      Vacuum quickly
      Good film thickness uniformity and repeatability
      Good film adhesion
      Precise PID process pressure control
      Fully automatic control
      Use preferred components
      Thoughtful after-sales service

application:
      Deposit single or multilayer films or alloy films of non-magnetic metal materials or magnetic metal materials, semiconductor or dielectric materials, etc.
      Used for thin film deposition of two-dimensional materials, quantum devices, superconductors, semiconductors, nano devices, optoelectronics, biological and other materials, etc.

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