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DE500 double electron gun electron beam evaporation thin film deposition system
DE500双电子枪电子束蒸发薄膜沉积系统001
DE500双电子枪电子束蒸发薄膜沉积系统001

DE500 double electron gun electron beam evaporation thin film deposition system

Stainless steel cavity, open the door before sealing by rubber ring, equipped with molecular pump or condensate pump and dry pump and corresponding valves, full-range vacuum gauge, dual electron guns, multiple crucible evaporation sources, automatic crucible guidance and programmed beam spot scanning, crystal film thickness control, PLC and industrial computer control

Configuration and overview:
Stainless steel cavity, open the door before sealing by rubber ring, equipped with molecular pump or condensate pump and dry pump and corresponding valves, full-range vacuum gauge, dual electron guns, multiple crucible evaporation sources, automatic crucible guidance and programmed beam spot scanning, crystal film thickness control, PLC and industrial computer control

Options:
      The substrate can be up to 8 inches
      The substrate can be heated to 950 degrees
      The substrate can be cooled and temperature controlled by liquid nitrogen
      The substrate can be TILT to prepare GLAD process film
      The substrate can be rotated
      Ion source cleaning or auxiliary deposition
      The substrate oxidation process
      Substrate pre-cleaning
      LOAD LOCK
      Glove box
      Vacuum interconnection or vacuum robot substrate transfer


Features:
      It is convenient for operation and maintenance inside the cavity
      High vacuum or ultra-high vacuum
      Vacuum quickly
      Co-evaporation to prepare alloy film
      The film thickness and rate have high resolution, and the film thickness meter controls the corresponding parts to accurately control the thickness and rate of the       multilayer or alloy film
      Good film thickness uniformity
      Fully automatic control
      Use preferred components
      Thoughtful after-sales service

application:
      Deposited metals include single-layer or multi-layer films, alloy films such as magnetic materials, semiconductors or dielectric materials
      LIFT-OFF process thin film deposition
      Optional substrate TILT to prepare GLAD process film
      Used for thin film deposition of two-dimensional materials, quantum devices, superconductors, semiconductors, nano devices, optoelectronics, biological and other materials, etc.

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