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DE3000, DE5000 Magnetron Sputtering Film Deposition System
DE3000,-DE5000磁控溅射薄膜沉积系统001
DE3000,-DE5000磁控溅射薄膜沉积系统002
DE3000,-DE5000磁控溅射薄膜沉积系统001
DE3000,-DE5000磁控溅射薄膜沉积系统002

DE3000, DE5000 Magnetron Sputtering Film Deposition System

Three DE300, DE500 magnetron sputtering chambers, LOAD LOCK and central manipulator sample chamber or vacuum interconnection pipeline

Configuration and overview:
Three DE300, DE500 magnetron sputtering chambers, LOAD LOCK and central manipulator sample chamber or vacuum interconnection pipeline

Options:
      The substrate can be up to 8 inches
      The substrate can be heated to 950 degrees
      The substrate can be cooled and temperature controlled by liquid nitrogen
      The substrate can be rotated
      Ion source cleaning or auxiliary deposition
      The substrate oxidation process
      Substrate pre-cleaning
      Glove box

Features:
      It is convenient for operation and maintenance inside the cavity
      High vacuum or ultra-high vacuum
      Vacuum quickly
      Good film thickness uniformity and repeatability
      Good film adhesion
      Fully automatic control
      Use preferred components
      Thoughtful after-sales service

application:
      Deposited metals include single or multilayer films of magnetic materials, semiconductors or dielectric materials
      Used for thin film deposition of two-dimensional materials, quantum devices, superconductors, semiconductors, nano devices, optoelectronics, biological and other materials, etc.

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