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DE4500 evaporation and magnetron sputtering thin film deposition system
DE4500蒸发和磁控溅射薄膜沉积系统
DE4500蒸发和磁控溅射薄膜沉积系统

DE4500 evaporation and magnetron sputtering thin film deposition system

The DE400 evaporation chamber and DE500 magnetron sputtering chamber are connected by LOAD LOCK vacuum, controlled by PLC and industrial computer

Configuration and overview:

The DE400 evaporation chamber and DE500 magnetron sputtering chamber are connected by LOAD LOCK vacuum, controlled by PLC and industrial computer


Options:

      The substrate can be up to 8 inches
      The substrate can be heated to 950 degrees
​​​​​​​      The substrate can be rotated
​​​​​​​      Ion source cleaning or auxiliary deposition
​​​​​​​      The substrate oxidation process
​​​​​​​      Substrate pre-cleaning
​​​​​​​      LOAD LOCK
​​​​​​​      Glove box
​​​​​​​      Vacuum interconnection

Features:
​​​​​​​      It is convenient for operation and maintenance inside the cavity
​​​​​​​      High vacuum or ultra-high vacuum
​​​​​​​      Vacuum quickly
​​​​​​​      Good film thickness uniformity
​​​​​​​      Fully automatic control
​​​​​​​      Use preferred components
​​​​​​​      Thoughtful after-sales service

application:
​​​​​​​      Deposited metals include single or multilayer films of magnetic materials, semiconductors, or dielectric materials
​​​​​​​      LIFT-OFF process thin film deposition
​​​​​​​      ​​​​​​​Used for thin film deposition of two-dimensional materials, quantum devices, superconductors, semiconductors, nano devices, optoelectronics, biological and other materials, etc.

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