(+86)10-67832716/17

Your location:
Homepage
/
/
/
DE600C Magnetron Sputtering System
DE600SPUTTER
DE600SPUTTER

DE600C Magnetron Sputtering System

DE600C magnetron sputtering system is assembled with multi magnetron sputtering sources for deposition metals, semiconductor, insulation materials on the up to 6 inch substrate, it can be used to sputter multilayer thin film or co-sputter for alloy thin film. It is the ideal tools for thin film R&D for the university and academy.

DE600C magnetron sputtering system is assembled with multi magnetron sputtering sources for deposition metals, semiconductor, insulation materials on the up to 6 inch substrate, it can be used to sputter multilayer thin film or co-sputter for alloy thin film. It is the ideal tools for thin film R&D for the university and academy.

Features

C-shape Sputtering Deposition Chamber with front open door for easy inside service.

PID downstream and upstream pressure control.
Good Film Uniformity and repeatability.
Safety interlock for critical components.

 

 

 

 

 

 

Configuration

Magnetron Sputter Chamber

C shape, 304 stainless steel chamber with viewport

Vacuum Pumping

turbo-pump (or Cryopump) and dry pump

Vacuum Valve

High vacuum gate valves

Chamber Vent Valve, Rough and Foreline angle valve, and gas valve

Vacuum Gauging

Wide range vacuum gauge and Pirani rough gauge

Sputtering Sources

 

Up to six 4” circle magnetron sputtering sources

The power supply can be DC, pulse DC or RF power supply

Sample Stage

Substrate rotating and heating or cooling

Pressure Control

Multiple channel Mass flow controller

Capacitance manometer for sputter process pressure PID control

Cooled Water Interlock

Cooling water flow sensors of interlock to protect sputter sources work properly

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Specification

The Base Vacuum Pressure in Sputter Chamber

better than 5E-8 Torr

Sample Loading Capacity

Max. 6 inch flat substrate

The Max. Temperature of the Sample Heater

600C (option 1000C)

The film uniformity

better than +/-5% over a rotating 6 inch Silicon wafer

General Sputtering Pressure

1-50mTorr

Product description

相关产品

There is currently no content to display
Please add data record on website background.

 COPYRIGHT© 2020 Beijing Deyi Tianli Technology Development Co., Ltd. All rights reserved ICP05065635  Website construction:www.xinnet.com

德仪科技
德仪科技