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DE600DL Magnetron Sputtering System
DE600DL
DE600DL

DE600DL Magnetron Sputtering System

DE600DL magnetron sputtering system is assembled with multi magnetron sputtering sources for deposition metals, semiconductor, insulation materials on the up to 6 inch substrate, it can be used to sputter multilayer thin film or co-sputter for alloy thin film. It is the ideal tools for thin film R&D for the university and academy.

DE600DL magnetron sputtering system is assembled with multi magnetron sputtering sources for deposition metals, semiconductor, insulation materials on the up to 6 inch substrate, it can be used to sputter multilayer thin film or co-sputter for alloy thin film. It is the ideal tools for thin film R&D for the university and academy.

Features D-shape Sputtering Deposition Chamber with front open door for easy inside service
PID downstream and upstream pressure control
Good Film Uniformity and repeatability 
Safety interlock for critical components

 

 

 

 

 

Configuration

Magnetron Sputtering chamber D shape, 304 stainless steel chamber with viewport
Vacuum Pumping turbo-pump (or Cryopump) and dry pump
Vacuum Valve High vacuum gate valves
Chamber Vent Valve, Rough and Foreline angle valve, and gas valve
Vacuum Gauging Wide range vacuum gauge and Pirani rough gauge
Sputtering Sources Up to six 4” circle magnetron sputtering sources
The power supply can be DC, pulse DC or RF power supply
Sample Stage  Substrate rotating and heating or cooling
Pressure Control Multiple channel Mass flow controller
Capacitance manometer for sputter process pressure PID  control
Cooled Water Interlock Cooling water flow sensors of interlock to protect    sputter sources work properly

 

 

 

 

 

 

 

 

 

 

 

 

Specification

The Base Vacuum Pressure in Sputter Chamber better than 3E-8 Torr
Sample Loading Capacity Max. 6 inch flat substrate
The Max. Temperature of the Sample Heater 600C (option 1000C)
The film uniformity  better than +/-5% over a rotating 6 inch Silicon wafer
General Sputtering Pressure 1-50mTorr

 

 

 

 

 

 

Load Lock Unit

Load Lock Chamber Base Vacuum Pressure is better than 5E-7 torr
Single or multi substrate loading stage
Option RF plasma cleaning

 

Product description

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德仪科技
德仪科技