(+86)10-67832716/17

Your location:
Homepage
/
/
/
DE600 Magnetron Sputtering System
DE600SPUTTER
DE600SPUTTER

DE600 Magnetron Sputtering System

LOAD LOCK Chamber (option) Chamber with front open door Cryopump and dry pump Up to six magnetron sputter cathode DC, RF or pulse DC power supply Sputter up or down Max. 8” substrate Substrate rotation Substrate bias (option) Substrate heating to 1000C (option) Substrate cooling (option) Up to four channel process gas PID sputter pressure control Manual or automatic system control Good film uniformity and repeatability For sputter metal, semiconductor and insulation materials.

LOAD LOCK Chamber (option) Chamber with front open door Cryopump and dry pump Up to six magnetron sputter cathode DC, RF or pulse DC power supply Sputter up or down Max. 8” substrate Substrate rotation Substrate bias (option) Substrate heating to 1000C (option) Substrate cooling (option) Up to four channel process gas PID sputter pressure control Manual or automatic system control Good film uniformity and repeatability For sputter metal, semiconductor and insulation materials.

 

Description

LOAD LOCK Chamber (option)

Chamber with front open door

Cryopump and dry pump

Up to six magnetron sputter cathode

DC, RF or pulse DC power supply

Sputter up or down

Max. 8” substrate

Substrate rotation

Substrate bias (option)

Substrate heating to 1832°F (option)

Substrate cooling (option)

Up to four channel process gas

PID sputter pressure control

Manual or automatic system control

Good film uniformity and repeatability

For sputter metal, semiconductor and insulation materials

Product description

相关产品

There is currently no content to display
Please add data record on website background.

 COPYRIGHT© 2020 Beijing Deyi Tianli Technology Development Co., Ltd. All rights reserved ICP05065635  Website construction:www.xinnet.com

德仪科技
德仪科技