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DE500CH E-beam Evaporation System
DE600三(四)电子枪电子束蒸发薄膜沉积系统001
DE600三(四)电子枪电子束蒸发薄膜沉积系统001

DE500CH E-beam Evaporation System

DE500CH Thin Film deposition system is assembled two e-beam evaporation sources for deposition metals, semiconductor, insulation materials (materials depends) on the up to 4 inch substrate, and it is assembled with worldwide well known components, the configuration / specification as per following description.

DE500CH Thin Film deposition system is assembled two e-beam evaporation sources for deposition metals, semiconductor, insulation materials (materials depends) on the up to 4 inch substrate, and it is assembled with worldwide well known components, the configuration / specification as per following description.

Features Unique Design of Substrate Chamber and Sources chamber isolated by UHV gate valve
All Metal Seal, True UHV System 
Stand along system frameworks and electric rack
E-beam source Water Interlock 
Optional Substrate Cooling

 

 

 

 

 

 

The DE500CH Electron Beam Evaporator is assembled with two e-beam sources,  the substrate is mounting on the horizontal axial on the side of chamber for the substrate polar to change the deposition angle.

Configuration

Evaporation Chamber 304 stainless steel chamber with viewport
Vacuum Pumping Cryo-pump or Turbo pump and dry rough pump
Vacuum Valve Pneumatic UHV valves
Evaporation Source One rotary six pocket E-BEAM source with 15cc crucibles
One one pocket E-BEAM source with 15cc crucibles
Substrate Chamber 304 stainless steel chamber with viewport
Top mounted rotary sample stage
Sample Stage

Side mounted tilt and rotary sample stage

(option heating to 600C)

(option cooling to -150C)

Film Control Crystal Film thickness Monitor and Control 
Vacuum Gauging Wide range vacuum gauge and rough gauge
Load Lock Chamber (Option) 304 stainless steel chamber of front open door with viewport

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Specification

The Base Vacuum Pressure Better than 9E-8 Torr
Sample Loading Capacity One Max. 4 inch flat substrate
Rate Resolution 0.05 Angstroms/sec
Thickness Resolution = 0.02 Angstroms 0.02 Angstroms

 

 

 

 

 

Typical Application  

For R & D Thin Film Deposition 

Ideal tools for LIFT-OFF process

Evaporate metal, Semiconductor or Insulation Materials

Evaporate Magnetic Materials

Product description

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