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DE3000 Multi Chamber Thin Film Deposition System
DE3000FAB8
DE3000FAB8

DE3000 Multi Chamber Thin Film Deposition System

Features

>  LOAD LOCK connect sputter and ebeam chamber

>  Sputter chamber with front open door

>  Multi sputter cathodes

>  eGun chamber with front open door

>  Multi pocket rotate eGun sources

>  Cryopump and dry pump

>  Max. 6” substrate

>  Substrate rotate

>  Substrate bias (option)

>  Substrate heating to 1832°F (option)

>  Up to four process gas

>  PID sputter pressure control

>  Manual or automatic system control

>  Good film uniformity and repeatability

>  For sputter metal, semiconductor and insulation materials

>  For deposition of multi-layer and alloy film

Product description
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