DE3000 Cluster high vacuum multi chamber nano thin film deposition system
The DE3000 Cluster contains multiple process chambers for depositing metal, semiconductor, and dielectric materials. Optional magnetron sputtering, electron beam evaporation, thermal resistance evaporation, ion beam cleaning or assisted deposition process. Single-layer film, multi-layer film, or alloy film can be deposited, which can be used for nano thin film material development and mass production. Suitable for FAB hundred level purification room, unmanned workshop.
Features |
Multiple process chambers, rubber ring sealing door, convenient operation and maintenance Wafers can be automatically transferred to any process chamber by the sample chamber robotCan be equipped with pre-vacuum chamberCan be equipped with EFEM to automatically transfer wafers in FOUPS to the pre-vacuum chamberCan handle 6-inch, 8-inch or 12-inch wafersThe whole system realizes automatic control through industrial computer and PLC |
process chamber
Cavity |
304 stainless steel cavity, rubber ring sealing door, with viewing window and baffle |
Vacuum pump |
Molecular pumps (or condensate pumps) and oil-free dry pumps |
Vacuum valve |
High vacuum plug valve, chamber inflation valve, rough extraction or pre-valve |
Vacuum measurement |
Wide range vacuum gauge and Pirani rough gauge |
Ultimate vacuum pressure |
<5E-8Torr |
Process chamber to restore original empty vacuum pressure time (After the wafer is transferred from the sample chamber to the process chamber) |
<10 minutes |
Process |
magnetron sputtering electron beam evaporation thermal resistance evaporation ion beam cleaning ion beam assisted deposition oxidation process |
Wafer Size |
Optional: 6 inches,8 inches,12 inches |
film thickness uniformity within the sheet |
≤ ± 3% |
Intersheet film thickness repeatability |
≤ ± 2% |
Slitting chamber
Vacuum pump | Molecular and dry pumps |
Vacuum valve |
High vacuum plug valve, cavity inflation valve, rough extraction valve |
Vacuum measurement |
Wide range vacuum gauge |
Ultimate vacuum pressure |
<9E-7Torr |
Manipulator |
Automatic wafer transfer |
Pre-vacuum chamber
Vacuum pump | Molecular and dry pumps |
Ultimate vacuum pressure |
<9E-7Torr |
Wafer loading capacity |
Loading Multiple Wafers |
EFEM
Two or more crystal boxes FOUP LOAD PORT |
High-speed and accurate wafer calibration, equipped with robot, with turning function, can realize random pick-and-place between layers in the cassette. |
Wafers in FOUP can be automatically transferred to the pre-vacuum chamber by the robot |
After the wafer runs empty, the number of particles with wafer surface size> 0.2um is less than 15.
- Added <30 particles with size> 0.2um on membrane
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