Beijing Deyi Tianli Technology Development Co., Ltd.

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DE3000 Cluster high vacuum multi chamber nano thin film deposition system

The DE3000 Cluster contains multiple process chambers for depositing metal, semiconductor, and dielectric materials. Optional magnetron sputtering, electron beam evaporation, thermal resistance evaporation, ion beam cleaning or assisted deposition process. Single-layer film, multi-layer film, or alloy film can be deposited, which can be used for nano thin film material development and mass production. Suitable for FAB hundred level purification room, unmanned workshop.

Features

Multiple process chambers, rubber ring sealing door, convenient operation and maintenance

Wafers can be automatically transferred to any process chamber by the sample chamber robot

Can be equipped with pre-vacuum chamber

Can be equipped with EFEM to automatically transfer wafers in FOUPS to the pre-vacuum chamber

Can handle 6-inch, 8-inch or 12-inch wafers

The whole system realizes automatic control through industrial computer and PLC

process chamber

Cavity	304 stainless steel cavity, rubber ring sealing door, with viewing window and baffle
Vacuum pump	Molecular pumps (or condensate pumps) and oil-free dry pumps
Vacuum valve	High vacuum plug valve, chamber inflation valve, rough extraction or pre-valve
Vacuum measurement	Wide range vacuum gauge and Pirani rough gauge
Ultimate vacuum pressure	＜5E-8Torr
Process chamber to restore original empty vacuum pressure time (After the wafer is transferred from the sample chamber to the process chamber)	<10 minutes
Process	magnetron sputtering electron beam evaporation thermal resistance evaporation ion beam cleaning ion beam assisted deposition oxidation process
Wafer Size	Optional: 6 inches,8 inches,12 inches
film thickness uniformity within the sheet	≤ ± 3%
Intersheet film thickness repeatability	≤ ± 2%

Slitting chamber

Vacuum pump	Molecular and dry pumps
Vacuum valve	High vacuum plug valve, cavity inflation valve, rough extraction valve
Vacuum measurement	Wide range vacuum gauge
Ultimate vacuum pressure	＜9E-7Torr
Manipulator	Automatic wafer transfer

Pre-vacuum chamber

Vacuum pump	Molecular and dry pumps
Ultimate vacuum pressure	＜9E-7Torr
Wafer loading capacity	Loading Multiple Wafers

EFEM

Two or more crystal boxes FOUP LOAD PORT

High-speed and accurate wafer calibration, equipped with robot, with turning function, can realize random pick-and-place between layers in the cassette.

Wafers in FOUP can be automatically transferred to the pre-vacuum chamber by the robot

After the wafer runs empty, the number of particles with wafer surface size> 0.2um is less than 15.