Beijing Deyi Tianli Technology Development Co., Ltd.

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DE500DL nano-film magnetron sputtering system

DE500DL nano-film magnetron sputtering system is equipped with multiple magnetron sputtering source, can be deposited metal, semiconductor, dielectric materials. Can be used for sputtering multilayer films, co-sputtering alloy films, reactive sputtering, etc. It is an ideal platform for materials and thin film deposition research and development and pilot testing.

Features

Sputtering coating cavity rubber ring seal before opening the door for internal operation
Sputtering distance adjustable
PID downstream and upstream pressure control
Good film uniformity and repeatability
Safety interlock protection
Optional ion beam cleaning or assisted deposition
OptionalRFplasma cleaning,Optional wedge film
PLC and industrial control automatic control

Main Configuration

coating chamber	The cavity is made of 304 stainless steel and has a viewing window.
Vacuum pump	Molecular pumps (or condensate pumps) and dry pumps
Vacuum valve	High vacuum board valve Cavity inflation valve, Roughing and pre-angle valve, gas stop valve
Vacuum measurement	Wide range vacuum gauge and Pirani rough gauge
sputtering source	Up to 6 sputtering sources DC, pulse DC, RF power supply, HIPPIMS power supply
Sample table	Rotary heating or cooling of sample stage
Gas and pressure control	Multi-gas flow meter PID control pressure control
Pre-vacuum sample chamber	Single or multiple substrate loading capability Automatic sample delivery

Main technical indicators

Limit vacuum degree of coating chamber	Better than 3E-8Torr (or 9E-9Torr)
Substrate Size	Optional: 2 inches, 4 inches, 6 inches, 8 inches, 12 inches
Maximum sample heater temperature	600 ℃ (optional 900 ℃)
film thickness uniformity	Better than +/-3%