Beijing Deyi Tianli Technology Development Co., Ltd.

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DE400DHL electron beam evaporation coating system

The DE400DHL electron beam evaporation coating system is equipped with a multi-crucible electron beam evaporation source, which can evaporate and deposit metal, semiconductor or dielectric materials on the substrate. It is an ideal platform for preparing lift-off process thin films and low micro materials.

Features

Open the door before the rubber ring of the evaporation cavity is sealed to facilitate the operation inside the cavity.

The opening of the substrate baffle is controlled by the film thickness meter closed loop.

Optional RF plasma or ion source substrate cleaning

Optional Substrate Oxidation

System Safety Interlock

Computer controlled fully automatic or manual operation

Main Configuration

evaporation chamber	304 stainless steel, front door with viewing window
Vacuum pump	Evaporation chamber equipped with molecular pump or condensate pump and oil-free mechanical pump
Vacuum valve	Pneumatically controlled high vacuum valve
Vacuum measurement	Wide range vacuum gauge for measuring vacuum and rough draw gauge
evaporation source	Automatic guiding of multi-crucible electron beam evaporation source
Sample table	spinning substrate Selectable Tilt and Rotary Substrate Table (Optional heating to 900 ℃) (Optional cooling to -150 ℃)
Film thickness detection	Crystal Oscillator Rate Film Thickness Monitoring
Pre-vacuum sample chamber	Single or multiple substrate loading capability Automatic sample delivery

Main technical indicators

ultimate vacuum degree	3E-8 Torr
Substrate Size	Optional: 2 inches, 4 inches, 6 inches, 8 inches, 12 inches
film thickness uniformity	Better than +/-3%
Evaporation rate resolution	0.01 A/s
Film thickness resolution	0.1 A