DE400P electron beam evaporation machine
DE400P electron beam evaporation coating system is equipped with electron beam evaporation source or thermal resistance evaporation source, which is used to deposit metal or dielectric film and lift-off process film deposition. For mass production.
Features |
|
Main Configuration
coating cavity |
304 stainless steel, rubber ring sealing door with viewing window |
Vacuum pump |
Molecular pumps (or condensate pumps) and dry pumps |
Vacuum valve |
High vacuum flapper valve, chamber charging valve, rough pumping or pre-stage valve, gas control valve |
Vacuum measurement |
Wide range vacuum gauge and Pirani rough gauge |
Coating source |
The number of electron gun crucible up to 8 High voltage power supply and programmable beam spot scanner |
Substrate table |
dome structure |
Thin film monitoring |
Crystal film thickness/rate monitoring |
Main technical indicators of coating room
Ultimate vacuum pressure |
<5E-8Torr |
Atmospheric pumping to 5E-7Torr time |
<40 minutes |
Substrate Size |
Optional: 2 inches, 4 inches, 6 inches, 8 inches, 12 inches |
film thickness uniformity within the sheet |
≤ +/-3% |
Intersheet film thickness repeatability |
≤ +/-2% |
Loading capacity
Equipment Model |
DE400P/5 |
DE400P/7 | DE400P/10 | DE400P/13 | DE400P/16 | DE400P/18 | DE400P/20 | ||||||||||||||
Substrate Size |
4" |
6" |
8" | 4" | 6" | 8" | 4" | 6" | 8" | 4" | 6" | 8" | 4" | 6" | 8" | 4" | 6" | 8" | 4" | 6" | 8" |
Number of substrates |
8 |
4 |
3 | 14 | 8 | 5 | 43 | 20 | 12 | 83 | 38 | 20 | 121 | 57 | 35 | 146 | 72 | 44 | 194 | 92 | 54 |
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