+

DE400P electron beam evaporation machine

DE400P electron beam evaporation coating system is equipped with electron beam evaporation source or thermal resistance evaporation source, which is used to deposit metal or dielectric film and lift-off process film deposition. For mass production.

 

Features
  • Can be evaporated metal, semiconductor, dielectric materials and magnetic materials
  • Preparation of LIFT-OFF process thin films
  • Thin film evaporation on the top and bottom of the grating, no film deposition on the side
  • Stainless steel cavity, rubber ring sealing door, convenient operation and maintenance
  • Optional ion source cleaning
  • The whole system realizes automatic control through industrial computer and PLC

 

 

 

 

 

Main Configuration

coating cavity

304 stainless steel, rubber ring sealing door with viewing window

Vacuum pump

Molecular pumps (or condensate pumps) and dry pumps

Vacuum valve

High vacuum flapper valve, chamber charging valve, rough pumping or pre-stage valve, gas control valve

Vacuum measurement

Wide range vacuum gauge and Pirani rough gauge

Coating source

The number of electron gun crucible up to 8

High voltage power supply and programmable beam spot scanner

Substrate table

dome structure

Thin film monitoring

Crystal film thickness/rate monitoring

 

 

Main technical indicators of coating room

Ultimate vacuum pressure

<5E-8Torr

Atmospheric pumping to 5E-7Torr time

<40 minutes

Substrate Size

Optional: 2 inches, 4 inches, 6 inches, 8 inches, 12 inches

film thickness uniformity within the sheet

≤ +/-3%

Intersheet film thickness repeatability

≤ +/-2%

 

 

Loading capacity

Equipment Model

DE400P/5

DE400P/7 DE400P/10 DE400P/13 DE400P/16 DE400P/18 DE400P/20
Substrate Size

4"

6"

8" 4" 6" 8" 4" 6" 8" 4" 6" 8" 4" 6" 8" 4" 6" 8" 4" 6" 8"
Number of substrates

8

4

3 14 8 5 43 20 12 83 38 20 121 57 35 146 72 44 194 92 54

Related Products