DE500CL double electron gun co-evaporation coating system
DE500CL dual electron gun co-evaporation coating system is equipped with two electron beam evaporation sources, which can co-evaporate and deposit metal, semiconductor or dielectric materials on the substrate. It is an ideal platform for preparing lift-off process films and low-micro materials.
| Features |
Open the door before the rubber ring of the evaporation cavity is sealed to facilitate the operation inside the cavity. The opening of the substrate baffle is controlled by the film thickness meter closed loop. Optional RF plasma or ion source substrate cleaning Optional Substrate Oxidation System Safety Interlock Computer controlled fully automatic or manual operation |
Main Configuration
| evaporation chamber | 304 stainless steel, front door with viewing window |
| Vacuum pump | Evaporation chamber equipped with molecular pump or condensate pump and oil-free mechanical pump |
| Vacuum valve | Pneumatically controlled high vacuum valve |
| Vacuum measurement | Wide range vacuum gauge for measuring vacuum and rough draw gauge |
| evaporation source | Two electron beam evaporation sources |
| Sample table |
Rotation substrate table Selectable Tilt and Rotary Substrate Table (Optional heating to 600 ℃) (Optional cooling to -150 ℃) |
| Film thickness detection | Crystal Oscillator Rate Film Thickness Monitoring |
| Pre-vacuum sample chamber |
Single or multiple substrate loading capability Automatic sample delivery |
Main technical indicators
| ultimate vacuum degree | 3E-8Torr |
| Substrate Size | Optional: 2 inches, 4 inches, 6 inches, 8 inches, 12 inches |
| film thickness uniformity | Better than +/-3% |
| Evaporation rate resolution | 0.01 A/s |
| Film thickness resolution | 0.1A |
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