DE400BUV ultra-high vacuum electron beam evaporation coating system
The DE400BUV ultra-high vacuum electron beam evaporation coating system is equipped with a multi-crucible electron beam evaporation source, which can evaporate and deposit metal, semiconductor or dielectric materials on the substrate. It is an ideal platform for preparing lift-off process thin films and low-micro materials.
| Features |
Evaporation chamber rubber ring sealed door for easy operation The opening of the substrate baffle is controlled by the film thickness meter closed loop. Optional RF plasma or ion source substrate cleaning Optional Substrate Oxidation System Safety Interlock Computer controlled fully automatic or manual operation |
Main Configuration
| evaporation chamber | 304 stainless steel, rubber ring sealing door |
| Vacuum pump | Evaporation chamber equipped with molecular pump or condensate pump and oil-free mechanical pump |
| Vacuum valve | Pneumatically controlled high vacuum valve |
| Vacuum measurement | Wide range vacuum gauge for measuring vacuum and rough draw gauge |
| evaporation source | Automatic guiding of multi-crucible electron beam evaporation source |
| Sample table |
Rotation substrate table Selectable Tilt and Rotary Substrate Table (Optional heating to 800 ℃) (Optional cooling to -150 ℃) |
| Film thickness detection | Crystal Oscillator Rate Film Thickness Monitoring |
Main technical indicators
| ultimate vacuum degree | 5E-9Torr |
| Substrate Size | Optional: 2 inches, 4 inches, 6 inches |
| film thickness uniformity | Better than +/-3% |
| Evaporation rate resolution | 0.01 A/s |
| Film thickness resolution | 0.1A |
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Address: No.29, Jinghai 3rd Road, Beijing Economic and Technological Development Zone
Fax: (86)10-67814077
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