Beijing Deyi Tianli Technology Development Co., Ltd.

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DE400BHV electron beam evaporation coating system

The DE400BHV electron beam evaporation coating system is equipped with a multi-crucible electron beam evaporation source, which can evaporate and deposit metal, semiconductor or dielectric materials on the substrate. It is an ideal platform for preparing lift-off process thin films and low micro materials.

Features

Evaporation chamber rubber ring sealed door for easy operation

The opening of the substrate baffle is controlled by the film thickness meter closed loop.

Optional RF plasma or ion source substrate cleaning

Optional Substrate Oxidation

System Safety Interlock

Computer controlled fully automatic or manual operation

Main Configuration

evaporation chamber	304 stainless steel, rubber ring sealing door
Vacuum pump	Evaporation chamber equipped with molecular pump or condensate pump and oil-free mechanical pump
Vacuum valve	Pneumatically controlled high vacuum valve
Vacuum measurement	Wide range vacuum gauge for measuring vacuum and rough draw gauge
evaporation source	Automatic guiding of multi-crucible electron beam evaporation source
Sample table	Rotation substrate table Selectable Tilt and Rotary Substrate Table (Optional heating to 600 ℃ or 900 ℃) (Optional cooling to -150 ℃)
Film thickness detection	Crystal Oscillator Rate Film Thickness Monitoring

Main technical indicators

ultimate vacuum degree	5E-8Torr
Substrate Size	Optional: 2 inches, 4 inches, 6 inches
film thickness uniformity	Better than +/-3%
Evaporation rate resolution	0.01 A/s
Film thickness resolution	0.1 A