DE400BHV electron beam evaporation coating system

The DE400BHV electron beam evaporation coating system is equipped with a multi-crucible electron beam evaporation source, which can evaporate and deposit metal, semiconductor or dielectric materials on the substrate. It is an ideal platform for preparing lift-off process thin films and low micro materials.



Evaporation chamber rubber ring sealed door for easy operation

The opening of the substrate baffle is controlled by the film thickness meter closed loop.

Optional RF plasma or ion source substrate cleaning

Optional Substrate Oxidation

System Safety Interlock

Computer controlled fully automatic or manual operation


Main Configuration

evaporation chamber 304 stainless steel, rubber ring sealing door
Vacuum pump Evaporation chamber equipped with molecular pump or condensate pump and oil-free mechanical pump
Vacuum valve Pneumatically controlled high vacuum valve
Vacuum measurement Wide range vacuum gauge for measuring vacuum and rough draw gauge

evaporation source

Automatic guiding of multi-crucible electron beam evaporation source
Sample table

Rotation substrate table

Selectable Tilt and Rotary Substrate Table

(Optional heating to 600 ℃ or 900 ℃)

(Optional cooling to -150 ℃)

Film thickness detection Crystal Oscillator Rate Film Thickness Monitoring


Main technical indicators

ultimate vacuum degree 5E-8Torr
Substrate Size Optional: 2 inches, 4 inches, 6 inches
film thickness uniformity Better than +/-3%
Evaporation rate resolution 0.01 A/s
Film thickness resolution 0.1 A

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