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DE5000 Multi-Cavity Magnetron Sputtering System

Features
  • Sputtering chamber with single or multiple targets
  • Sputtering of metal and dielectric materials
  • ion beam cleaning
  • Substrate size: optional: 2 inches, 4 inches, 6 inches, 8 inches, 12 inches
  • Vacuum degree <5E-8Torr
  • Thickness uniformity <± 3%
  • Substrate automatic sample transfer mechanism
  • PLC industrial control PC automatic control
  • Scientific research, pilot test and mass production

 

EFEM can be equipped with FAB 100-level purification room and unmanned workshop.

After the wafer runs empty, the number of particles with wafer surface size> 0.2um <15

The number of particles with size> 0.2um on the new film is less than 30.

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