DE700PVD

Features

Multiple Sputtering Sources
Can sputter metal, semiconductor, dielectric materials and magnetic materials
Sputtered monolayer, multilayer or co-sputtered alloy films or reactive sputtering
Stainless steel cavity, rubber ring sealed front door, easy to operate and maintain
PID downstream or upstream pressure control
Optional Ion Source Assisted Deposition
Optional RF PlasmaCleaning or ion source cleaning
The whole system realizes automatic control through industrial computer and PLC
For pilot and mass production

Main Configuration

sputtering chamber	304 stainless steel, rubber ring sealing door with viewing window
Vacuum pump	Molecular pumps (or condensate pumps) and dry pumps
Vacuum valve	High vacuum plug-in valve, cavity inflation valve, roughing or pre-stage valve, gas control valve
Vacuum measurement	Wide range vacuum gauge and Pirani rough gauge
sputtering source	multiple magnetron sputtering cathodes DC, Pulse DC, RF, HIPIMS Power
Substrate table	The substrate can be rotated, optionally heated or cooled
Pressure control	Multi-gas flow meter and pressure gauge, PID sputtering pressure control
Optional film monitoring	Crystal film thickness/rate monitoring
Optional pre-vacuum chamber	Stainless steel cavity with observation window, automatic substrate transfer
Safety interlock	Sputtering source and whole system safety interlock protection

Main technical indicators of coating room

Ultimate vacuum pressure	＜9E-8Torr
Substrate Size	Optional: 3 inches, 4 inches, 6 inches, 8 inches, 12 inches
Optional substrate heating	600℃
film thickness uniformity within the sheet	≤ +/-3%
Intersheet film thickness repeatability	≤ +/-2%