DE600DL nano-film magnetron sputtering system

DE600DL nano-film magnetron sputtering system is equipped with multiple magnetron sputtering source, can be deposited metal, semiconductor, dielectric materials. Can be used for sputtering multilayer film, co-sputtering alloy film, reactive sputtering, optional wedge film, etc. It is an ideal platform for materials and thin film deposition research and development and pilot testing.



sputtering coating chamberThe rubber ring seals the front door to facilitate internal operation

Sputtering distance adjustable 

PID downstream and upstream pressure control 

Good film uniformity and repeatability

 Safety interlock protection

Optional ion beam cleaning or assisted deposition

OptionalRFplasma cleaning

PLCAnd industrial control automatic control



Main Configuration

coating chamber The cavity is made of 304 stainless steel and has a viewing window.
Vacuum pump Molecular pumps (or condensate pumps) and dry pumps
Vacuum valve High vacuum board valve
Cavity inflation valve, Roughing and pre-angle valve, gas stop valve
Vacuum measurement

Wide range vacuum gauge and Pirani rough gauge

sputtering source

More than 6 sputtering sources
DC, pulsed DC, RF power, HIPPIMSPower

Sample table Rotary heating or cooling of sample stage

Gas and pressure control

Multi-gas flow meter
PID control pressure control

Cold water safety interlock Sputtering source cooling water distribution sensor for sputtering source safety interlock protection
Pre-vacuum sample chamber

Single or multiple substrate loading capability

Automatic sample delivery



Main technical indicators

Limit vacuum degree of coating chamber

better than 3E-8Torr (or 9E-9Torr)

Substrate Size

Optional: 2 inches, 4 inches, 6 inches, 8 inches, 12Inches

Maximum sample heater temperature 600 ℃ (optional 900 ℃)
film thickness uniformity



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