DE600DL nano-film magnetron sputtering system is equipped with multiple magnetron sputtering source, can be deposited metal, semiconductor, dielectric materials. Can be used for sputtering multilayer film, co-sputtering alloy film, reactive sputtering, optional wedge film, etc. It is an ideal platform for materials and thin film deposition research and development and pilot testing.
| Features |
sputtering coating chamberThe rubber ring seals the front door to facilitate internal operation
Sputtering distance adjustable
PID downstream and upstream pressure control
Good film uniformity and repeatability
Safety interlock protection
Optional ion beam cleaning or assisted deposition
OptionalRFplasma cleaning
PLCAnd industrial control automatic control
|
Main Configuration
| coating chamber |
The cavity is made of 304 stainless steel and has a viewing window. |
| Vacuum pump |
Molecular pumps (or condensate pumps) and dry pumps |
| Vacuum valve |
High vacuum board valve
Cavity inflation valve, Roughing and pre-angle valve, gas stop valve |
| Vacuum measurement |
Wide range vacuum gauge and Pirani rough gauge
|
|
sputtering source
|
More than 6 sputtering sources
DC, pulsed DC, RF power, HIPPIMSPower
|
| Sample table |
Rotary heating or cooling of sample stage |
|
Gas and pressure control
|
Multi-gas flow meter
PID control pressure control
|
| Cold water safety interlock |
Sputtering source cooling water distribution sensor for sputtering source safety interlock protection |
| Pre-vacuum sample chamber |
Single or multiple substrate loading capability
Automatic sample delivery
|
Main technical indicators
| Limit vacuum degree of coating chamber |
better than 3E-8Torr (or 9E-9Torr)
|
| Substrate Size |
Optional: 2 inches, 4 inches, 6 inches, 8 inches, 12Inches
|
| Maximum sample heater temperature |
600 ℃ (optional 900 ℃) |
| film thickness uniformity |
Better/-3%
|
