DE500P Electron Beam Evaporation Coating System

The DE500P electron beam evaporation coating system is equipped with two electron beam evaporation sources, which can co-evaporate and deposit metal, semiconductor or dielectric materials on the substrate.



Open the door before the rubber ring of the evaporation cavity is sealed to facilitate the operation inside the cavity.

The opening of the substrate baffle is controlled by the film thickness meter closed loop.

System Safety Interlock

Computer controlled fully automatic or manual operation

Typical applications

for mass production

Ideal platform for LIFT-OFF process

Evaporatable metal, semiconductor or dielectric materials

evaporable magnetic material

dual-source co-evaporation












Main Configuration

evaporation chamber 304 stainless steel, front door with viewing window
Vacuum pump Evaporation chamber equipped with molecular pump or condensate pump and oil-free mechanical pump
Vacuum valve Pneumatically controlled high vacuum valve
Vacuum measurement Wide range vacuum gauge for measuring vacuum and rough draw gauge
evaporation source Two electron beam evaporation sources
Sample table

revolution/rotation substrate table

(Optional heating to 300 ℃)

Film thickness detection Crystal Oscillator Rate Film Thickness Monitoring











Main technical indicators

ultimate vacuum degree 5E-8 Torr
Substrate Size Optional: 2 inches, 4 inches, 6 inches, 8 inches, 12 inches
film thickness uniformity within the sheet ≤ +/-3%
Intersheet film thickness repeatability ≤ +/-2%
Evaporation rate resolution 0.01 A/s
Film thickness resolution 0.1 A

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