Beijing Deyi Tianli Technology Development Co., Ltd.

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DE500P Electron Beam Evaporation Coating System

The DE500P electron beam evaporation coating system is equipped with two electron beam evaporation sources, which can co-evaporate and deposit metal, semiconductor or dielectric materials on the substrate.

Features

Open the door before the rubber ring of the evaporation cavity is sealed to facilitate the operation inside the cavity.

The opening of the substrate baffle is controlled by the film thickness meter closed loop.

System Safety Interlock

Computer controlled fully automatic or manual operation

Typical applications

for mass production

Ideal platform for LIFT-OFF process

Evaporatable metal, semiconductor or dielectric materials

evaporable magnetic material

dual-source co-evaporation

Main Configuration

evaporation chamber	304 stainless steel, front door with viewing window
Vacuum pump	Evaporation chamber equipped with molecular pump or condensate pump and oil-free mechanical pump
Vacuum valve	Pneumatically controlled high vacuum valve
Vacuum measurement	Wide range vacuum gauge for measuring vacuum and rough draw gauge
evaporation source	Two electron beam evaporation sources
Sample table	revolution/rotation substrate table (Optional heating to 300 ℃)
Film thickness detection	Crystal Oscillator Rate Film Thickness Monitoring

Main technical indicators

ultimate vacuum degree	5E-8 Torr
Substrate Size	Optional: 2 inches, 4 inches, 6 inches, 8 inches, 12 inches
film thickness uniformity within the sheet	≤ +/-3%
Intersheet film thickness repeatability	≤ +/-2%
Evaporation rate resolution	0.01 A/s
Film thickness resolution	0.1 A